Falcon Red

Home > Industries > Industrial Robotics > Catalog

Intel® Agilex™ 9 SoC FPGA (Direct RF-Series)

Integrated Direct RF sampling up to 64 Gsps.
Advanced thermal management for demanding factory floor and outdoor operation.
Up to sixteen channels of 12 Gsps DAC converters and 20 channels of 4 Gsps ADC converters integrated with an SoC FPGA.

SECO SOM-SMARC-ZU (AMD Zynq™ UltraScale+™)

Operational temperature range: -40°C to +85°C.
Compliance with EN18031-1 standards for secure and reliable embedded systems.
Continuous monitoring of device status and activity with Clea.

Advantech SOM-5993 (Intel® Xeon® D-1700)

Supports up to 128GB ECC memory.
Various expansion (PCIe x16 Gen4, PCIe X8, 4PCIe X1, 4 USB3.0, 2 SATA).
COM Express R3.0 Basic Module Type 7 pin out.

Innodisk 2.5” SATA SSD 3TR6-P

Data Security: iData Guard for abnormal power failure.
iCell Technology: Integrated capacitors to prevent data loss during power failure.
AES-256 encryption.

Phison Pascari X201 Enterprise SSD

PCIe Gen5 interface for extreme bandwidth.
Up to 14.5 GB/s sequential read, 12 GB/s write, and up to 3300K/1050 IOPS.
Capacity Up to 30.72 TB.

Innodisk Aerospace DDR4 Wide Temp DRAM

Sulfuration resistant for harsh atmospheric conditions.
Conformal coating (Acrylic/Urethane) as standard.
Gold finger thickness of 30μ” for stable signal integrity.

Advantech SKY-8134DU (1U Rugged Server)

Powered by 5th/4th Gen Intel® Xeon® Scalable processors.
Wide operating temperature range (-40°C to +70°C).
IPMI 2.0-compliant management with reliability and security enhancements.

SECO Industrial Robot Teach Pendant (Custom Solutions)

Sunlight-readable high-brightness display.
Integrated industrial radio and 5G connectivity.
IP67-rated waterproof and dustproof enclosure.

Advantech MIC-770 V3 (Rugged Edge IPC)

IP40 dust proof for deployment in harsh industrial environments.
Supports Advantech iBMC 1.2 remote out-of-band power management solution on WISE-DeviceOn.
Supports Intel® vPro™/AMT and TPM technologies.

Intel® Stratix® 10 GX FPGA

Hyperflex™ FPGA Architecture.
Heterogeneous 3D SiP Transceiver Tiles.
Secure Device Manager (SDM).

Innodisk M.2 (S80) 3MG2-P SSD

Zero mechanical interference.
iSMART disk health monitoring.
Intelligent error recovery system.

SECO SOM-COMe-BT6-MTL (Intel® Core™ Ultra)

Two SO-DIMM slot supporting DDR5-5600 IBECC memory, up to 64GB.
Supports up to 4 independent 4K displays.
Integrated Intel® Xe LPG graphics controller with up to 8 Xe cores (128 EU).

Advantech EKI- 9528 Series (Managed Switch)

-40 to 75°C wide operating temperature.
M12 connector with ruggedized IP54 certified housing.
X-Ring Pro delivers rapid and predictable convergence.

Phison aiDAPTIV AI-Series SSD

Optimized for LLM (Large Language Model) fine-tuning at the edge.
High endurance NAND for intensive read/write cycles.
Simplified hardware footprint for AI integration.

Advantech SOM-2532 (Intel Atom® x6000)

Supports iManager, WISE-DeviceOn and Embedded Software APIs.
Onboard storage eMMC up to 32GB.
SMARC2.0 & SMARC2.1 Compliance.

NVIDIA Jetson AGX Orin Industrial

Up to 248 TOPS AI performance.
Industrial temperature range -40°C to +85°C.
ECC memory support and functional safety features.

Kontron SMARC-sAMX8Plus (NXP i.MX 8M Plus)

Integrated NPU for AI acceleration (up to 2.3 TOPS).
Extended temperature support.
Long-term availability for industrial programs.

ADLINK ROScube-X RQX-59G

NVIDIA Jetson AGX Orin support.
Native ROS 2 and DDS compatibility.
Fanless design for vibration-heavy environments.

Elma ATR Enclosures

Supports 3U/6U OpenVPX payloads.
Conduction- and air-cooled configurations.
MIL-STD-810 and DO-160 compliant.

Teledyne FLIR Blackfly S GigE Camera

Global shutter CMOS sensors.
GigE Vision and PoE support.
Wide operating temperature options.

SBG Systems Ellipse-D Inertial Navigation System

Dual-antenna GNSS for precise heading (outdoor use).
Industrial-grade MEMS IMU.
CAN, Ethernet, and serial interfaces.

Honeywell HG4930 IMU

Tactical-grade MEMS sensors.
Low noise and bias instability.
Designed for vibration-intensive platforms.

Velodyne Alpha Prime LiDAR

360° field of view.
Long detection range (245 m).
Designed for harsh industrial environments.

Ouster OS2-128 LiDAR

128-channel resolution.
IP68/IP69K rated enclosure.
Ethernet-based data output.

Microchip PolarFire® SoC FPGA

Deterministic RISC-V cores.
Low power consumption compared to competing FPGA SoCs.
Designed for mission- and safety-critical systems.

HENSOLDT TRML-4D Radar Module

4D radar imaging capability.
All-weather sensing performance.
High immunity to dust, fog, and rain.

Cubic SDR Transceivers

Multi-Platform.
Modular & Scalable.
Cable-less Design.

Lanner V3S AI Edge Vehicle Computer

Intel® Atom™ x7-E3950 processor.
Wide range operating temperature from -40 to 70°C.
E-Mark and shock/vibration compliance.

Curtiss-Wright CHAMP-WB VPX Chassis

Supports OpenVPX backplanes.
Conduction-cooled architecture.
SWaP-optimized design.

PerceptIn DragonFly Stereo Vision Module

Hardware-synchronized stereo cameras.
Low-latency depth computation.
Optimized for SLAM applications.

EtherCAT Motion Control Drives (Beckhoff AX5000)

Ultra-fast EtherCAT communication.
Integrated safety functions.
Compact, high power density design.

Maxon EC-i High Torque Brushless Motors

High torque-to-weight ratio.
Long operational lifetime.
Designed for continuous duty cycles.

Sensonor STIM300 IMU

Extremely low bias drift.
Compact and lightweight.
Proven in aerospace and robotics applications.

u-blox ZED-F9P GNSS Module

Multi-band GNSS with RTK support.
Centimeter-level positioning accuracy.
UART, SPI, I2C, USB interfaces.

Septentrio mosaic-X5 GNSS Receiver

Multi-constellation GNSS tracking.
Anti-jamming and anti-spoofing features.
Compact OEM form factor.

Bosch BMI088 IMU

Low vibration sensitivity.
Separate accelerometer and gyroscope die.
SPI interface.

Analog Devices ADIS16470 IMU

Factory-calibrated bias and sensitivity.
Low noise MEMS sensors.
SPI communication.

Xilinx Kria KV260 Vision AI Starter Kit

Zynq UltraScale+ MPSoC.
Hardware-accelerated AI pipelines.
Industrial connectivity interfaces.

Qualcomm RB5 Robotics Platform

Integrated AI accelerator.
5G and Wi-Fi 6 connectivity.
Low-power edge processing.

Sierra Wireless AirLink XR80 Router

5G and LTE connectivity.
Dual Ethernet and serial ports.
Designed for harsh environments.

Vicor DCM3623 DC-DC Converter Module

High efficiency power conversion.
Compact ChiP package.
Wide input voltage range.

TDK-Lambda HWS-A Series Power Supply

Long-life electrolytic capacitors.
High efficiency operation.
Compact industrial design.

FLIR Boson Thermal Camera Module

LWIR thermal imaging.
Radiometric measurement capability.
Lightweight and compact form factor.

Sony IMX477 CMOS Sensor Module

12.3 MP resolution.
High dynamic range.
MIPI CSI-2 interface.

SICK TiM781 LiDAR Sensor

25 m scanning range.
Ethernet interface.
Industrial-rated housing.

Hokuyo UST-30LX LiDAR

270° scanning range.
Ethernet connectivity.
Compact design.

Kollmorgen AKM Series Servo Motors

High torque density.
Feedback encoder integration.
Designed for precision motion.

Harmonic Drive FHA-C Mini Actuator

Zero backlash gear system.
High positional accuracy.
Integrated servo motor.

TE Connectivity Raychem Spec 55 Wire

High temperature resistance.
Lightweight construction.
Chemical and abrasion resistant.

Amphenol MIL-DTL-38999 Series III Connector

MIL-spec qualified.
High vibration resistance.
Environmental sealing.

Keysight N9918A FieldFox Handheld Analyzer

Portable rugged design.
Wide frequency coverage.
Battery powered operation.

Curtiss-Wright VPX6-1961 SBC

High-performance multi-core CPU.
OpenVPX compliant.
Designed for harsh environments.

Mercury Systems EnsembleSeries HDS6605

NVMe-based storage.
Designed for VPX systems.
Conduction-cooled options.